CE TRAVEL
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CETIS provides complete end-to-end solutions for travel and personal documents, such as biometric passports, ID cards and driving licences. Due to our flexible modular approach we can provide production of security documents as well as complete solutions for identity management and document issuance or supply any part of the chain, including passport and card components (e.g. passport e-covers and prelaminated sheets for data page and cards) which ensure an even greater level of security and personal identity protection.
CETIS highly secure and ICAO-compliant contactless passport e-covers, suitable for e-passport booklets, are optimised to ensure compatibility with most standard passport booklets.
The inner chip carrier layer is constructed from quality synthetic material and compatible with all types of security papers, providing perfect protection for the already integrated electronic chip and antenna.
One of the thinnest passport e-covers on the market features superior, smooth and flat finishing as well as durability in accordance with international standards.
Options
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Thickness One of the thinnest solutions on the market. |
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Durability Long-term resistance to mechanical stresses. |
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Security Protected against forgery and counterfeiting. |
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Data storage Secure storage of personal data and biometrics, using chips from reputable producers. |
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Compatibility Optimised to ensure compatibility with most standard passport booklets. |
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Production process Easy integration in the manufacturing process, increasing productivity of the passport producer. |
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Composition All layers are constructed from quality materials which are compatible with all types of passport covers, providing perfect protection for the embedded electronic chip and antenna. |
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Finish Smooth and flat finish. |
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Verification Compliant with ICAO and ISO standards. |
One of the key aspects of passport protection is a polycarbonate data page.
This enables additional options for improved passport protection against copying and counterfeiting due to its complex structure with embedded electronic chip ad antenna, thereby guaranteeing security, durability, flexibility, compatibility and reliability.
Options
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Consult with our experts, choose among various alternatives, and find the right solution for your specific needs.
Zaupajte jih našim izkušenim strokovnjakom.
Upravni odbor družbe CETIS d.d. sklicuje 37. skupščino družbe CETIS d.d., ki bo v petek, 8. 11. 2024, ob 10.00 uri v poslovnih prostorih na sedežu družbe. Preberite več
Upravni odbor družbe CETIS d.d. objavlja Nerevidirano konsolidirano polletno poročilo Skupine CETIS in nerevidirano polletno poročilo družbe CETIS d.d. za leto 2024. Preberite več
Upravni odbor družbe CETIS d.d. objavlja sklepe 36. redne skupščine delničarjev družbe CETIS d.d., ki je bila 18. 6. 2024. Preberite več
Vljudno vas vabimo, da nas med 11. in 13. decembrom 2024 obiščete na 7. konferenci o upravljanju meja in identitete - 7th Border Management and Identity Conference (7BMIC) v Bangkoku na Tajskem. Preberite več
Vljudno vas vabimo, da nas med 13. in 15. novembrom 2024 obiščete na 19. Simpoziju ICAO TRIP (programu ICAO za identifikacijo potnikov) v Montrealu v Kanadi. Preberite več
Vljudno vas vabimo, da nas med 2. in 4. oktobrom 2024 obiščete na Digital Government Africa 2024, ministrskem vrhu o e-upravi v Afriki v Lusaki v Zambiji. Preberite več
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